Micrel, Inc.

SY89538L

October 2005

M9999-101105-B

8

Absolute Maximum Ratings

(1)

LVPECL Outputs (Surge) .........................100mA

LVPECL Outputs (Continuous)...................50mA

LVDS Outputs...........................................±10mA

Lead Temperature (soldering, 20 sec.) .......... +260°C

Operating Ratings

(2)

Supply Voltage

Package Thermal Resistance (Junction-to-Ambient)

With Die attach soldered to GND:

TQFP (

TQFP (

TQFP (

With Die attach NOT soldered to GND

(3):

TQFP (

TQFP (

TQFP (

Package Thermal Resistance (Junction-to-Board)

TQFP (

DC Electrical Characteristics

(4)

Power Supply

Symbol

Parameter

Condition

Min

Typ

Max

Units

PLL Power Supply

Note 5

3.0

3.3

3.6

V

Control Logic Supply Voltage

Note 5

3.0

3.3

3.6

V

Output Supply Voltage

2.375

2.5

2.625

V

3.0

3.3

3.6

V

Power Supply Current

240

300

mA

Analog Supply Current

10

mA

Output Supply Current

55

mA

Digital Supply Current

175

mA

LVCMOS/LVTTL Input Control Logic

Symbol

Parameter

Condition

Min

Typ

Max

Units

Input High Voltage

2.0

V

Input Low Voltage

0.8

V

Input High Current

–125

150

µA

Input Low Current

–300

µA

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings

conditions for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. It is recommended that the user always solder the exposed die pad to a ground plane for enhanced heat dissipation.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.