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CY7C1366B-166AI Datasheet(PDF) 9 Page - Cypress Semiconductor

Part # CY7C1366B-166AI
Description  9-Mb (256K x 36/512K x 18) Pipelined DCD Sync SRAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1366B-166AI Datasheet(HTML) 9 Page - Cypress Semiconductor

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CY7C1366B
CY7C1367B
Document #: 38-05096 Rev. *B
Page 9 of 32
ADV
83
G4
A9
Input-
Synchronous
Advance Input signal, sampled on the rising edge of
CLK, active LOW. When asserted, it automatically
increments the address in a burst cycle.
ADSP
84
A4
B9
Input-
Synchronous
Address Strobe from Processor, sampled on the
rising edge of CLK, active LOW. When asserted LOW,
addresses presented to the device are captured in the
address registers. A1: A0 are also loaded into the burst
counter. When ADSP and ADSC are both asserted, only
ADSP is recognized. ASDP is ignored when CE1 is
deasserted HIGH.
ADSC
85
P4
A8
Input-
Synchronous
Address Strobe from Controller, sampled on the
rising edge of CLK, active LOW. When asserted LOW,
addresses presented to the device are captured in the
address registers. A1: A0 are also loaded into the burst
counter. When ADSP and ADSC are both asserted, only
ADSP is recognized.
ZZ
64
T7
H11
Input-
Asynchronous
ZZ “sleep” Input, active HIGH. When asserted HIGH
places the device in a non-time-critical “sleep” condition
with data integrity preserved. For normal operation, this
pin has to be LOW or left floating. ZZ pin has an internal
pull-down.
DQs, DQPs 58,59,62,63,
68,69,72,73,
8,9,12,13,18
,19,22,23,74
,24
P7,K7,G7,
E7,F6,H6,
L6,N6,D1,
H1,L1,N1,
E2,G2,K2,
M2,D6,P2
J10,K10,L10,
M10,D11,
E11,F11,G11
,J1,K1,L1,M1
,D2,E2,F2,
G2,C11,N1
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into
an on-chip data register that is triggered by the rising
edge of CLK. As outputs, they deliver the data contained
in the memory location specified by the addresses
presented during the previous clock rise of the read
cycle. The direction of the pins is controlled by OE.
When OE is asserted LOW, the pins behave as outputs.
When HIGH, DQs and DQPX are placed in a three-state
condition.
VDD
15,41,65,91 C4,J2,J4,
J6,R4
D4,D8,E4,E8
,F4,F8,G4,
G8,H4,H8,J4
,J8,K4,K8,L4
,L8,M4,M8
Power Supply Power supply inputs to the core of the device.
VSS
17,40,67,90 D3,D5,E5,
E3,F3,F5,
G5,H3,H5,
K3,K5,L3,
M3,M5,N3,
N5,P3,P5
H2,C4,C5,C6
,C7,C8,D5,
D6,D7,E5,E6
,E7,F5,F6,F7
,G5,G6,G7,
H5,H6,H7,J5
,J6,J7,K5,K6,
K7,L5,L6,L7,
M5,M6,M7,
N4,N8
Ground
Ground for the core of the device.
VSSQ
5,10,21,26,
55,60,71,76
I/O Ground
Ground for the I/O circuitry.
CY7C1367B–Pin Definitions (continued)
Name
TQFP
BGA
(2-Chip
Enable)
fBGA
I/O
Description


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