WeEn Semiconductors

Z0103MN

4Q Triac

Z0103MN

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Product data sheet

15 September 2018

6 / 14

8. Thermal characteristics

Table 5. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance

from junction to solder

point

full cycle; Fig. 6

-

-

15

K/W

full cycle; printed circuit board mounted;

minimum footprint; Fig. 7

-

156

-

K/W

thermal resistance

from junction to

ambient free air

full cycle; printed circuit board mounted;

pad area; Fig. 8

-

70

-

K/W

003aac210

1

10

1

10

(K/W)

P

t

Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width