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S-19243XXXH Datasheet(PDF) 51 Page - ABLIC Inc. |
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S-19243XXXH Datasheet(HTML) 51 Page - ABLIC Inc. |
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51 / 74 page 
(1) Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Number of copper foil layer 2 Copper foil layer [mm] 1 Land pattern and wiring for testing: t0.070 2- 3- 4 74.2 x 74.2 x t0.070 (2) Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Number of copper foil layer 4 1 2 3 4 (3) Item Specification 1 2 3 4 (4) 1 2 3 4 Thermal via - Material FR-4 Number of copper foil layer 4 Board D - Thermal via 74.2 x 74.2 x t0.035 Land pattern and wiring for testing: t0.070 114.3 x 76.2 x t1.6 Copper foil layer [mm] Pattern for heat radiation: 2000mm 2 t0.070 Thermal via Number: 4 Diameter: 0.3 mm Material FR-4 Number of copper foil layer Board A 74.2 x 74.2 x t0.070 Board B 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 Board E Thermal via - Size [mm] Specification Item 74.2 x 74.2 x t0.035 Copper foil layer [mm] 4 Copper foil layer [mm] Pattern for heat radiation: 2000mm 2 t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 Size [mm] 74.2 x 74.2 x t0.035 114.3 x 76.2 x t1.6 IC Mount Area enlarged view HSOP-6 Test Board No. HSOP6-A-Board-SD-1.0 ABLIC Inc. |
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