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AS4C8M32MD2A-25BCN Datasheet(PDF) 32 Page - Alliance Semiconductor Corporation |
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AS4C8M32MD2A-25BCN Datasheet(HTML) 32 Page - Alliance Semiconductor Corporation |
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32 / 75 page  Table 28. Absolute Maximum Rating Symbol Parameter Values Unit Note VIN, VOUT Voltage on any I/O relative to VSS -0.4~1.6 V VDD1 VDD1 supply voltage relative to VSS -0.4~2.3 V 2 VDD2 VDD2 supply voltage relative to VSS -0.4~1.6 V 2 VDDCA VDDCA supply voltage relative to VSSCA -0.4~1.6 V 2,4 VDDQ VDDQ supply voltage relative to VSSQ -0.4~1.6 V 2,3 TSTG Storage Temperature -55~125 °C 5 Notes: 1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. See “Power-Ramp” in section “Power-Up and Initialization” for relationships between power supplies. 3. VREFCA 0.6 ≦ VDDCA; however, VREFCA may be ≧ VDDCA provided that VREFCA ≦ 300mV. 4. VREFDQ 0.6 ≦ VDDQ; however, VREFDQ may be ≧ VDDQ provided that VREFDQ ≦ 300mV. 5. Storage Temperature is the case surface temperature on the center/top side of the LPDDR2 device. For the measurement conditions, please refer to JESD51-2 standard. Table 29. Operating Temperature Condition Symbol Parameter Values Unit Note TOPER Operating Temperature Range -25~85 °C Notes: 1. Operating temperature is the case surface temperature at the center of the top side of the device. 2. Either the device operating temperature or the temperature sensor can be used to set an appropriate refresh rate, determine the need for AC timing derating, and/or monitor the operating temperature. When using the temperature sensor, the actual device case temperature may be higher than the TCASE rating that applies for the operating temperature range. For example, TCASE could be above 85˚C when the temperature sensor indicates a temperature of less than 85˚C. Table 30. Recommended Operating Conditions Symbol Parameter Min. Typ. Max. Unit Note VDD1 (DC) Core power 1 1.7 1.8 1.95 V 1 VDD2 (DC) Core power 2 1.14 1.2 1.3 V VDDCA (DC) Input buffer power 1.14 1.2 1.3 V VDDQ (DC) I/O buffer power 1.14 1.2 1.3 V IL Input leakage current -2 - 2 A 2 IVREF VREF supply leakage current -1 - 1 A 3 Notes: 1. VDD1 uses significantly less power than VDD2. 2. The minimum limit requirement is for testing purposes. The leakage current on VREFCA and VREFDQ pins should be minimal. 3. Although DM is for input only, the DM leakage shall match the DQ and DQS/DQS# output leakage specification. AS4C8M32MD2A-25BCN Confidential - 32 of 75 - Rev.1.0 Jun. 2018 |
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