 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
2N2222AE Datasheet(PDF) 3 Page - First Silicon Co., Ltd |
|
||||||||||||||||||||||||||||||
2N2222AE Datasheet(HTML) 3 Page - First Silicon Co., Ltd |
|
|
3 / 3 page 
G M 0.08 (0.003 X D 3 PL J -X- -Y- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 463C-01 OBSOLETE, NEW STANDARD 463C-02. A B Y 1 2 3 N 2 PL K C -T- SEATING PLANE DIM A MIN NOM MIN NOM INCHES 1.50 1.60 1.70 0.059 MILLIMETERS B 0.75 0.85 0.95 0.030 C 0.60 0.70 0.80 0.024 D 0.23 0.28 0.33 0.009 G 0.50 BSC H 0.53 REF J 0.10 0.15 0.20 0.004 K 0.30 0.40 0.50 0.012 L 1.10 REF M −−− −−− 10 − N −−− −−− 10 −−− S 1.50 1.60 1.70 0.059 0.063 0.067 0.034 0.040 0.028 0.031 0.011 0.013 0.020 BSC 0.021 REF 0.006 0.008 0.016 0.020 0.043 REF −−− 10 −−− 10 0.063 0.067 MAX MAX M H H L G RECOMMENDED PATTERN OF SOLDER PADS S SC-89 2N2222AE 2008. 02. 18 1/3 Revision No : 0 |
|
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
