Multilayer Ceramic Capacitors

Approval Sheet

Page 11 of 11

ASC Safety Certified X1/Y2_(S2)_010X_AS

May. 2019

b.) Reflow soldering :

Fig. 4.2 Reflow soldering profile

For Sn/Ag/Cu Series solder paste (Pb-Free)

◙ Cooling

After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is

recommended to minimize stress in the solder joint.

◙ Cleaning

All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate

contamination that could cause electrolytic surface corrosion. Good results can be obtained by using

ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as

component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove

flux residues and contamination from under the chips is very important.