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S252P100D602CT Datasheet(PDF) 11 Page - WALSIN TECHNOLOGY CORPORATION |
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S252P100D602CT Datasheet(HTML) 11 Page - WALSIN TECHNOLOGY CORPORATION |
11 / 11 page Multilayer Ceramic Capacitors Approval Sheet Page 11 of 11 ASC Safety Certified X1/Y2_(S2)_010X_AS May. 2019 b.) Reflow soldering : Fig. 4.2 Reflow soldering profile For Sn/Ag/Cu Series solder paste (Pb-Free) ◙ Cooling After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is recommended to minimize stress in the solder joint. ◙ Cleaning All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to eliminate contamination that could cause electrolytic surface corrosion. Good results can be obtained by using ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such as component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove flux residues and contamination from under the chips is very important. |
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