Approval sheet

Page 4 of 7

ASC_VH0603 Green Series- V08

Aug.2018

Environment Reliability Test

Characteristic

Test method and description

High Temperature

Storage

The specimen shall be subjected to 125 ± 2℃for 1000 ± 12 hours in a thermostatic bath without

load and then stored at room temperature and normal humidity for 1 to 2 hours. The change of

varistor voltage shall be within 10 ﹪

Temperature Cycle

The temperature cycle of specified

temperature shall be repeated five times and

then stored at room temperature and normal

humidity for one or two hours. The change of

varistor voltage shall be within 10﹪and

mechanical damage shall be examined.

Step

Temperature

Period

1

-40±3℃

30Min±3

2

Room Temperature

1 hour

3

125±3℃

30Min±3

4

Room Temperature

1 hour

High Temperature

Load

After being continuously applied the maximum allowable voltage at 85 ± 2℃ for 1000± 2 hours,

the specimen shall be stored at room temperature and normal humidity for one or two hours,

the change of varistor voltage shall be within 10﹪.

Damp Heat Load/

Humidity Load

The specimen should be subjected to 40 ± 2℃, 90 to 95 ﹪RH environment, and the maximum

allowable voltage applied for 1000 hours, then stored at room temperature and normal humidity

for one or two hours. The change of varistor voltage shall be within 10﹪

Low Temperature

Storage

The specimen should be subjected to -40 ± 2℃, without load for 500 hours and then stored at

room temperature for one or two hours. The change of varistor voltage shall be within 10 ﹪

SOLDERING CONDITION

1.

The IP reflow and temperature of Soldering for Pb free

IR reflow Pb Free Process suggestion profile

(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150

μm

(2) Ramp-up rate (217℃ to Peak) + 3℃/second max

(3) Temp. maintain at 175 +/-25℃ 180 seconds max

(4) Temp. maintain above 217 ℃ 60-150 seconds

(5) Peak temperature range 245℃ +20℃/ -10 ℃ time within 5 ℃ of actually peak temperature (tp) 10~20

seconds

(6) Ramp down rate +6 ℃/second max