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XC2164D51 Datasheet(PDF) 3 Page - Torex Semiconductor |
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XC2164D51 Datasheet(HTML) 3 Page - Torex Semiconductor |
3 / 8 page PACKAGING INFORMATION SOT-26 PAD LAYOUT PAD DIMENSIONS unit [ µm] Chip Size 1.3 ×0.8 mm Chip Thickness 280 ± 20 µ Pad Aperture 100 × 100 µ * Stand-by control pin has a pull-up resistor built-in. MARKING RULE 1 Represents product series : XC2164 series 2 Represents divider ratio <Chip Enable> * B,C,D : fundamental only. <Output Enable> * L,M,N : fundamental only. 3 Represents recommended frequency & Rf, Cg & Cd values *) Please refer to the ordering information table above. 4 Represents the assembly lot no. (Based on internal standards.) RATIO RATIO K L RATIO f0/1 f0/2 M N RATIO MARK A B MARK C D f0/4 f0/8 f0/4 f0/8 XC2164 Series f0/1 f0/2 FUNCTION Q0 Clock Output SOT-26 (TOP-VIEW) PIN NAME 1 514 27 -264 -264 514 222 -450 -264 47 264 -450 264 MARK MARK ICs for use with Crystal Oscillators PIN NUMBER PAD DIMENSIONS XY VDD Power Supply 2 VSS Ground 6 INH Stand-by Control* 3XT Crystal Oscillator Connection (Output) 4XT Crystal Oscillator Connection (Input) 5 1 2 3 4 6 5 (650,400) (-650,-400) Y X 65 4 3 2 1 1 2 3 4 Semiconductor Ltd. 3 |
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