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PC910L0YIP0F Datasheet(PDF) 1 Page - Sharp Corporation

Part # PC910L0YIP0F
Description  High Speed 10Mb/s, High CMR DIP 8 pin OPIC Photocoupler
Download  14 Pages
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Manufacturer  SHARP [Sharp Corporation]
Direct Link  http://sharp-world.com/
Logo SHARP - Sharp Corporation

PC910L0YIP0F Datasheet(HTML) 1 Page - Sharp Corporation

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PC910L0NSZ0F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC910L)
2. Approved by VDE, DIN EN60747-5-2
(∗) (as an
option), file No. 40008898 (as model No. PC910L)
3. Package resin : UL flammability grade (94V-0)
(∗)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. High speed interfaces for computer peripherals
2. Programmable controllers
3. Inverter
■ Applications
High Speed 10Mb/s, High CMR
DIP 8 pin ∗OPIC
Photocoupler
1. DIP 8 pin package
2. Double transfer mold package
(Ideal for Flow Soldering)
3. High speed response
(tPHL : TYP. 48 ns, tPLH : TYP. 50 ns)
4. Low input current drive (IFHL : MAX. 5 mA)
5. Instantaneous common mode rejection voltage
(CMH : MIN.10 kV/µs, CML : MIN. −10 kV/µs)
6. TTL and LSTTL compatible output
7. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
8. Lead-free and RoHS directive compliant
■ Description
PC910L0NSZ0F Series contains a LED optically
coupled to an OPIC chip.
It is packaged in a 8 pin DIP.
Input-output isolation voltage(rms) is 5.0kV, High
speed response (TYP. 10 Mb/s) and CMR is MIN.
10 kV/µs.
1
Sheet No.: D2-A05602EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC910L0NSZ0F Series
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.


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