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LM5155-Q1 Datasheet(PDF) 45 Page - Texas Instruments |
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LM5155-Q1 Datasheet(HTML) 45 Page - Texas Instruments |
45 / 47 page www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN ALL AROUND 0.05 MAX ALL AROUND (1) 10X (0.5) (1.9) 12X (0.25) 12X (0.5) (2.65) (R0.05) TYP ( 0.2) VIA TYP (1.075) WSON - 0.8 mm max height DSS0012C PLASTIC SMALL OUTLINE - NO LEAD 4224220/A 02/2018 SYMM 1 6 7 12 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:25X 13 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSDE METAL |
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