Datasheet

12/21

BA00DD0XX series

BA00CC0XX series

TSZ02201-0R6R0A600080-1-2

5.Sep.2018 Rev.004

TSZ22111･15･001

© 2012 ROHM Co., Ltd. All rights reserved.

www.rohm.com

●Power Dissipation

When using at temperatures over Ta=25°C, please refer to the heat reducing characteristics shown in Fig.28 through 30.

The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at

Fig.29 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the

diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a

normal temperature (25°C), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures

less than the acceptable loss Pd.

The calculation method for power consumption Pc(W) is as follows:

Pc = (Vcc-Vo) x Io + Vcc x Icca

Acceptable loss Pd

≤Pc

Solving this for load current Io in order to operate within the acceptable loss,

Io

≤

(Please refer to Fig.8 and 20 for Icca.)

Pd - Vcc x Icca

Vcc-Vo

Vcc :

Vo :

Io :

Icca :

Input voltage

Output voltage

Load current

Circuit current

0

5

10

15

20

25

0

25

50

75

100

125

150

Ambient temperature Ta(°C)

Fig.29

Fig.28

TO220FP-5

(1) When using a maximum heat sick :

θj-c=6.25(°C /W)

(2) When using an IC alone :

θj-c=62.5(°C /W)

(1) 20.0

(2) 2.0

Fig.30

0.0

0.4

0.8

1.2

1.6

2.0

0

25

50

75

100

125

150

Ambient temperature Ta(°C)

TO252-5

1.30

Mounted on a Rohm standard board

Board size : 70×70×1.6mm

Copper foil area :7×7mm

TO252-

5θja=96.2(°C/W)

0

1

2

3

4

5

6

7

8

9

10

0

25

50

75

100

125

150

Ambient temperature Ta(°C)

(3)7.3W

(2)5.5W

(1)2.3W

HRP5