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LK1AF Datasheet(PDF) 3 Page - Mitsubishi Electric Semiconductor

Part No. LK1AF
Description  SLIM POWER RELAY WITH HIGH INRUSH CURRENT CAPABILITY
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Maker  MITSUBISHI [Mitsubishi Electric Semiconductor]
Homepage  http://www.mitsubishichips.com
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LK1AF Datasheet(HTML) 3 Page - Mitsubishi Electric Semiconductor

   
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LK
61
6-1. Electrical life test
(5 A 277 V AC, resistive load)
Sample: LK1aF-12V, 6 pcs.
Operation frequency: 20 times/min.
(ON/OFF = 1.5s: 1.5s)
Ambient temperature: 26
°C 79°F
Circuit:
Change of pick-up and drop-out voltage
Change of contact resistance
DC12V
Contact
welding
detection
and Mis-
contacting
detection
circuit
AC277V
05
10
No. of operations,
×104
0
20
40
60
80
100
Pick-up voltage
Drop-out voltage
Max.
Min.
Max.
Min.
05
10
No. of operations,
×104
Max.
Min.
0
10
20
30
40
50
6-2. Electrical life test
(UL lamp load test TV-5)
Tested sample: LK1aF-12V, 6 pcs.
• Overload test
Load: 7.5 A 120 V AC (60 Hz),
Inrush: 111 A
Operation frequency: 10 times/min
(ON: OFF = 1 s: 5 s)
No. of operations: 50 ope.
• Endurance test
Load: 5A 120 V AC (60 Hz),
Inrush: 78 A
Operation frequency: 10 times/min
(ON: OFF = 1 s: 5 s)
No. of operations: 25,000 ope.
Change of pick-up and drop-out voltage
Change of contact resistance
No. of operations,
×104
Max.
Min.
Max.
Min.
0
0
2.5
20
40
60
80
100
Pick-up voltage
Drop-out voltage
No. of operations,
×104
Max.
Min.
0
0
2.5
10
20
30
40
50
NOTES
1. Cleaning
This relay is not the sealed type, so it can-
not be immersion cleaned. Be careful that
flux does not overflow onto the PC board
or penetrate inside the relay.
2. Soldering
We recommend the following soldering
conditions.
1) Automatic soldering
* Preheating: 100
°C 212°F, within 2 mins
(PC board solder surface)
* Soldering: 260
°C 500°F, within 5 s
2) Hand soldering
* Iron tip temperature: 280 to 300
°C 536
to 571
°F
* Soldering iron: 30 to 60W
* Soldering time: Within 3 s
For Cautions for Use, see Relay Technical Information (Page 11 to 39).


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