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GD25S512MDFER Datasheet(PDF) 23 Page - GigaDevice Semiconductor (Beijing) Inc.

Part # GD25S512MDFER
Description  3.3V Uniform Sector Dual and Quad Serial Flash
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Manufacturer  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Direct Link  http://www.gigadevice.com/
Logo GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD25S512MDFER Datasheet(HTML) 23 Page - GigaDevice Semiconductor (Beijing) Inc.

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3.3V Uniform Sector
Dual and Quad Serial Flash
GD25S512MD
23
7.1.
Software Die Select (C2H)
Each stacked die has a pre-
assigned “Die ID#” by the factory, in the sequence of 0x00, 0x01, etc. At any given time,
there can only be one Active Die within the GD25S package, to communicate with the external SPI controller. After power-
up, Die #0 is always the Active Die. Software Die Select (C2H) instruction is used to select a specific die to be active,
according to the 8-bit Die ID following the C2H instruction as illustrated in Figure 4
“Concurrent Operations” can be realized by assigning the current Active Die to perform a Program/Erase operation
which requires some amount of time to finish. While the internal Program/Erase operation is ongoing, the controller can
issue a “Software Die Select (C2H)” instruction to select another die to be active. Depending on the system requirement, a
Read, Program or Erase operation can be performed on the newly se
lected Active Die. “Read while Program/Erase” or
“Multi-Die Program/Erase” can be performed in such fashion, to improve system Program/Erase throughput and to avoid
constant Program/Erase Suspend and Resume activities in certain applications.
Figure 4 Software Die Select Sequence Diagram
7.2. Read Active Die ID# (F8H)
The Read Active Die ID# command is used to read ID of active die within the MCP package, and each bit being
latched-in on the rising edge of SCLK. Then the active die ID# is shifted out on SO, and each bit being shifted out, at a Max
frequency fR, on the falling edge of SCLK. The Active Die ID# may be read at any time, even while a Program, Erase or
Read cycle is in progress.
Figure 5 Read Active Die ID# Sequence Diagram
Command
0
1
2
3
4
5
6
7
C2H
CS#
SCLK
SI
SO
High-Z
8
9 10 11 12 13 14 15
MSB
7
6
5
4
3
2
1
0
Die ID#
MSB
Command
0
1
2
3
4
5
6
7
F8H
CS#
SCLK
SI
SO
High-Z
8
9 10 11 12 13 14 15
7
6
5
4
3
2
1
0
MSB
Die ID#
MSB


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