- 4 -

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION

IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR

HEADQUARTERS OF SAMSUNG ELECTRONICS.

datasheet

e·MMC

KLMxGxGEND-B031

SAMSUNG CONFIDENTIAL

INTRODUCTION

SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a

simple read and write to memory using MMC protocol v5.0 which is a industry standard.

e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply

voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz DDR – up to 400MBps with bus widths of 8 bit in order

to improve sequential bandwidth, especially sequential read performance.

There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.

Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to

faster product development as well as faster times to market.

The embedded flash management software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The

FTL supports all features of the Samsung NAND flash and achieves optimal performance.

1.0 PRODUCT LIST

[Table 1] Product List

2.0 KEY FEATURES

embedded MultiMediaCard Ver. 5.0 compatible. Detail description is referenced by JEDEC Standard

SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard

- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,

Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200

- Non-supported Features : Large Sector Size (4KB)

 Additional feature : HS400 mode (200MHz DDR - up to 400Mbps)

 Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems)

 Data bus width : 1bit (Default), 4bit and 8bit

 MMC I/F Clock Frequency : 0 ~ 200MHz

MMC I/F Boot Frequency : 0 ~ 52MHz

 Temperature : Operation (-25C ~ 85C), Storage without operation (-40C ~ 85C)

 Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V)

Capacities

e·MMC Part ID

NAND Flash Type User Density (%)

Power System

Package size

Pin Configuration

8GB

KLM8G1GEND-B031

64Gb MLC x 1

91.0%

- Interface power :

VDD (1.70V ~ 1.95V or

2.7V ~ 3.6V)

- Memory power :

VDDF (2.7V ~ 3.6V)

11.5mm x 13mm x 0.8mm

153FBGA

16 GB

KLMAG2GEND-B031

64Gb MLC x 2

32 GB

KLMBG4GEND-B031

64Gb MLC x 4

11.5mm x 13mm x 1.0mm

64 GB

KLMCG8GEND-B031

64Gb MLC x 8