LITE-ON

TECHNOLOGY

CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Part

No. : LTW-C191TS5

Page :

9

of

12

BNS-OD-C131/A4

CAUTIONS

1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office

equipment, communication equipment and household applications).Consult Liteon’s Sales in advance

for information on applications in which exceptional reliability is required, particularly when the failure

or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,

traffic control equipment, medical and life support systems and safety devices).

2. Storage

The package is sealed:

The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within

one year, while the LEDs is packed in moisture-proof package with the desiccants inside.

The package is opened:

The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.

It is recommended that LEDs out of their original packaging are IR-reflowed within 672hrs.

For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed

container with appropriate desiccant, or in a desiccators with nitrogen ambient.

LEDs stored out of their original packaging for more than one week should be baked at about 60 deg C for at least

20 hours before solder assembly.

3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.

4. Soldering

Recommended soldering conditions:

Reflow soldering

Soldering iron

Pre-heat

Pre-heat time

Peak temperature

Soldering time

150~200°C

120 sec. Max.

260°C Max.

10 sec. Max.(Max. two times)

Temperature

Soldering time

300°C Max.

3 sec. Max.

(one time only)

Soldering notes:

and circuit boards, no single temperature profile works for all possible combinations.

PCB-specific characterization.

LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and

board-level assembly.

The results of this testing are verified through post-reflow reliability testing.

and reliably surface mounted.

Figure on page3 shows a sample temperature profile compliant to JEDEC standards.

You can use this example as a generic target to set up your reflow process.

solder paste manufacturer to avoid damaging the device and create a reliable solder joint.