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SLVE2.8.TC Datasheet(PDF) 4 Page - Semtech Corporation

Part No. SLVE2.8.TC
Description  EPD TVS™ Diodes For ESD and Latch-Up Protection
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Maker  SEMTECH [Semtech Corporation]
Homepage  http://www.semtech.com
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SLVE2.8.TC Datasheet(HTML) 4 Page - Semtech Corporation

   
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© 2003 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
SLVE2.8 and SLVG2.8
Circuit Diagrams
Common Mode Protection (SLVE2.8 and SLVG2.8)
Device Connection
Electronic equipment is susceptible to transient distur-
bances from a variety of sources including: ESD to an
open connector or interface, direct or nearby lightning
strikes to cables and wires, and charged cables “hot
plugged” into I/O ports. The SLV series is designed to
protect sensitive components from damage and latch-
up which may result from such transient events. The
SLVG2.8 is designed to protect one unidirectional line
while the SLVE2.8 is designed to protect one bidirec-
tional line (or two differential lines). The options for
connecting the devices are as follows:
SLVE2.8: Common mode protection of one bidirec-
tional data line is achieved by connecting the data
line input/output at pins 2 and 3. Pins 1 and 4 are
connected to ground. For differential protection,
pins 1 and 4 can be connected to a second I/O
line. For best results, the ground connection
should be made directly to a ground plane on the
board. The path length should be kept as short as
possible to minimize parasitic inductance.
SLVG2.8: Common mode protection of one unidi-
rectional line is achieved by connecting the line to
be protected at pins 2 and 3. Pins 1 and 4 are
connected to ground. For best results, the ground
connection should be made directly to a ground
plane on the board. The path length should be
kept as short as possible to minimize parasitic
inductance.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
1
2
3
4
Line
In
Line
Out
1
2
3
4
Line 2
In
Line 2
Out
Line 1
In
Line 1
Out
Differential Mode Protection (SLVE2.8 only)
1
2
3
4
1
2
3
4
SLVG2.8
SLVE2.8
Applications Information


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