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TM497FBK32S-80 Datasheet(PDF) 7 Page - Texas Instruments |
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TM497FBK32S-80 Datasheet(HTML) 7 Page - Texas Instruments |
7 / 12 page TM497FBK32, TM497FBK32S 4 194 304 BY 32-BIT TM893GBK32, TM893GBK32S 8 388 608 BY 32-BIT EXTENDED DATA OUT DYNAMIC RAM MODULES SMMS668 – NOVEMBER 1996 7 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) – 1 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage range on any pin (see Note 1) – 1 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Short-circuit output current 50 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power dissipation 8 W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free-air temperature range, TA 0 °C to 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg –55 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values are with respect to VSS. recommended operating conditions MIN NOM MAX UNIT VCC Supply voltage 4.5 5 5.5 V VIH High-level input voltage 2.4 6.5 V VIL Low-level input voltage (see Note 2) – 1 0.8 V TA Operating free-air temperature 0 70 °C NOTE 2: The algebraic convention, where the more negative (less positive) limit is designated as minimum, is used for logic-voltage levels only. electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS‡ ’497FBK32-60 ’497FBK32-70 ’497FBK32-80 UNIT PARAMETER TEST CONDITIONS‡ MIN MAX MIN MAX MIN MAX UNIT VOH High-level output voltage IOH = – 5 mA 2.4 2.4 2.4 V VOL Low-level output voltage IOL = 4.2 mA 0.4 0.4 0.4 V II Input current (leakage) VCC = 5.5 V, VI = 0 V to 6.5 V, All others = 0 V to VCC ± 10 ± 10 ± 10 µA IO Output current (leakage) VCC = 5.5 V, VO = 0 V to VCC, CAS high ± 10 ± 10 ± 10 µA ICC1 Read- or write-cycle current (see Note 3) VCC = 5.5 V, Minimum cycle 880 800 720 mA ICC2 Standby current VIH = 2.4 V (TTL), After one memory cycle, RAS and CAS high 16 16 16 mA ICC2 Standby current VIH = VCC – 0.2 V (CMOS), After one memory cycle, RAS and CAS high 8 8 8 mA ICC3 Average refresh current (RAS only or CBR) (see Note 3) VCC = 5.5 V, Minimum cycle, RAS cycling, CAS high (RAS only); RAS low after CAS low (CBR) 880 800 720 mA ICC4 Average page current (see Note 4) VCC = 5.5 V, tPC = MIN, RAS low, CAS cycling 560 480 400 mA ‡ For test conditions shown as MIN / MAX, use the appropriate value specified under recommended operating conditions. NOTES: 3. Measured with a maximum of one address change while RAS = VIL 4. Measured with a maximum of one address change while CAS = VIH |
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