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CC12H3A Datasheet(PDF) 8 Page - Eaton All Rights Reserved.

Part # CC12H3A
Description  High I짼t Chip fuses
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Manufacturer  EATON [Eaton All Rights Reserved.]
Direct Link  https://www.eaton.com
Logo EATON - Eaton All Rights Reserved.

CC12H3A Datasheet(HTML) 8 Page - Eaton All Rights Reserved.

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Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4309 BU-MC16040
November 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Technical Data 4309
Effective November 2017
CC12H
High I²t Chip fuses
t
tP
ts
TC -5°C
Time 25°C to Peak
Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin)
100°C
150°C
• Temperature max. (Tsmax)
150°C
200°C
• Time (Tsmin to Tsmax) (ts)
60-120 Seconds
60-120 Seconds
Average ramp up rate Tsmax to Tp
3°C/ Second Max.
3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)*
Table 1
Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)
20 Seconds**
30 Seconds**
Average ramp-down rate (Tp to Tsmax)
6°C/ Second Max.
6°C/ Second Max.
Time 25°C to Peak Temperature
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
235°C
220°C
≥2.5mm
220°C
220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm
260°C
260°C
260°C
1.6 – 2.5mm
260°C
250°C
245°C
>2.5mm
250°C
245°C
245°C


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