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74LS04 Datasheet(PDF) 1 Page - Silicon Supplies

Part # 74LS04
Description  Low Power Schottky Logic
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Manufacturer  SS [Silicon Supplies]
Direct Link  https://siliconsupplies.com/
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74LS04 Datasheet(HTML) 1 Page - Silicon Supplies

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Die Size (Unsawn)
1080 x 990
42 x 39
Minimum Bond Pad Size
116 x 116
4.6 x 4.6
Die Thickness
350 (±20)
13.78 (±0.79)
Top Metal Composition
Al 1%Si 1.1µm
Back Metal Composition
N/A – Bare Si
Low Power Schottky Logic – 74LS04
Hex Inverter Gates Logic IC in bare die form
High speed – 19ns (Typ) propagation delay
Direct drop-in replacement for obsolete
components in long term programs.
Rev 1.0
Ordering Information
The following part suffixes apply:
No suffix - MIL-STD-883 /2010B Visual Inspection
For High Reliability versions of this product please see
Supply Formats:
Mechanical Specification
Default – Die in Waffle Pack (400 per tray capacity)
Sawn Wafer on Tape – On request
Unsawn Wafer – On request
Die Thickness <> 350µm(14 Mils) – On request
Assembled into Ceramic Package – On request
The 74LS04 Hex Inverter is fabricated using a 2µm 40V
Bipolar process. The device contains six independent
inverters with standard push-pull outputs which perform the
Boolean function Y = Ᾱ in positive logic.
Die Dimensions in µm (mils)
1080 (42)

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