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XC7445B Datasheet(PDF) 59 Page - Freescale Semiconductor, Inc |
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XC7445B Datasheet(HTML) 59 Page - Freescale Semiconductor, Inc |
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59 / 64 page  MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1 Freescale Semiconductor 59 Document Revision History 10 Document Revision History Table 20 provides a revision history for this hardware specification. Table 20. Document Revision History Rev. No. Substantive Change(s) 0 Initial release. 1 Updated for Rev F devices; information specific to Rev C devices is now documented in a separate part number specifications; see Section 11.2, “Part Numbers Not Fully Addressed by This Document,” for more information. Removed 600 and 800 MHz speed grades. Increased leakage current specifications in Table 6 from 10 to 30 µA. Changed core voltage to 1.3 V; all instances of VDD and AVDD updated. Updated power consumption specifications in Table 7. Reduced I/O power guidance in Table 7 from <20% to <5%. Added footnote 1 to Figure 9 and Figure 11. Removed CI and WT from Input Setup and Input Hold lists in Table 10; these are output-only signals. Removed INT, HRESET, MCP, SRESET, and SMI from Input Setup and Input Hold lists in Table 10; these are asynchronous inputs. Added TT[0:3] to Input Setup, Input Hold, Output Valid, and Output Hold lists in Table 10; these were mistakenly omitted in Rev 0. Updated Table 13 and Table 14 to reflect new L3 AC timing in Rev F devices. Corrected Note 10 in Table 16 and Table 17; this is an event pin, not an enable pin. Corrected entries for L3_ECHO_CLK[1,3] in Table 17; these are I/O pins, not input-only. Added Note 16 to Table 17; all No Connect pins must be left unconnected. Changed name of PLL_EXT to PLL_CFG[4] and updated all instances. Updated Table 18 to reflect PLL configuration settings for Rev F devices. Added dimensions D2 and E3 to Figure 20. Transposed dimensions D4 and E4 in Figure 21 (dimensions were reversed). Revised Figure 24 and Section 9.7, “JTAG Configuration Signals.” Revised format of Section 11.2, “Part Numbers Not Fully Addressed by This Document,” and added Table 23 through Table 26. Revised Section 9.8.3, “Heat Sink Selection Example,” and added additional thermal modeling information, including Figure 28. Changed maximum heat sink clip spring force in Section 9.8, “Thermal Management Information,” from 5.5 lbs to 10 lbs. Changed substrate marking for MPC7445 in Figure 29; all MPC744x device substrates are marked MPC7440. Changed substrate marking for MPC7455 in Figure 29; all MPC745x device substrates are marked MPC7450. |
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