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XC7445B Datasheet(PDF) 58 Page - Freescale Semiconductor, Inc |
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XC7445B Datasheet(HTML) 58 Page - Freescale Semiconductor, Inc |
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58 / 64 page  MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1 58 Freescale Semiconductor System Design Information temperature—airflow, board population (local heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology, system air temperature rise, altitude, etc. Due to the complexity and the many variations of system-level boundary conditions for today's microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection, and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for the board, as well as system-level designs. For system thermal modeling, the MPC7445 and MPC7455 thermal model is shown in Figure 30. Four volumes will be used to represent this device. Two of the volumes, solder ball, and air and substrate, are modeled using the package outline size of the package. The other two, die, and bump and underfill, have the same size as the die. Dimensions for these volumes for the MPC7445 and MPC7455 are given in Figure 20 and Figure 22, respectively. The silicon die should be modeled 9.10 × 12.25 × 0.74 mm with the heat source applied as a uniform source at the bottom of the volume. The bump and underfill layer is modeled as 9.10 × 12.25 × 0.069 mm (or as a collapsed volume) with orthotropic material properties: 0.6 W/(m • K) in the xy-plane and 2 W/(m • K) in the direction of the z-axis. The substrate volume is 25 × 25 × 1.2 mm (MPC7445) or 29 × 29 × 1.2 mm (MPC7455), and this volume has 18 W/(m • K) isotropic conductivity. The solder ball and air layer is modeled with the same horizontal dimensions as the substrate and is 0.9 mm thick. It can also be modeled as a collapsed volume using orthotropic material properties: 0.034 W/(m • K) in the xy-plane direction and 3.8 W/(m • K) in the direction of the z-axis. Figure 30. Recommended Thermal Model of MPC7445 and MPC7455 Bump and Underfill Die Substrate Solder and Air Die Substrate Side View of Model (Not to Scale) Top View of Model (Not to Scale) x y z Conductivity Value Unit Bump and Underfill kx 0.6 W/(m • K) ky 0.6 kz 2 Substrate k18 Solder Ball and Air kx 0.034 ky 0.034 kz 3.8 |
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