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XC7445B Datasheet(PDF) 57 Page - Freescale Semiconductor, Inc |
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XC7445B Datasheet(HTML) 57 Page - Freescale Semiconductor, Inc |
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57 / 64 page  MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1 Freescale Semiconductor 57 System Design Information Dow-Corning Corporation 800-248-2481 Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dow.com Shin-Etsu MicroSi, Inc. 888-642-7674 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com Thermagon Inc. 888-246-9050 4707 Detroit Ave. Cleveland, OH 44102 Internet: www.thermagon.com The following section provides a heat sink selection example using one of the commercially available heat sinks. 9.8.3 Heat Sink Selection Example For preliminary heat sink sizing, the die-junction temperature can be expressed as follows: Tj = Ta + Tr + (RθJC + Rθint + Rθsa) × Pd where: Tj is the die-junction temperature Ta is the inlet cabinet ambient temperature Tr is the air temperature rise within the computer cabinet RθJC is the junction-to-case thermal resistance Rθint is the adhesive or interface material thermal resistance Rθsa is the heat sink base-to-ambient thermal resistance Pd is the power dissipated by the device During operation, the die-junction temperatures (Tj) should be maintained less than the value specified in Table 4. The temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ta) may range from 30° to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to 10°C. The thermal resistance of the thermal interface material (Rθint) is typically about 1.5°C/W. For example, assuming a Ta of 30°C, a Tr of 5°C, a CBGA package RθJC = 0.1, and a typical power consumption (Pd) of 15.0 W, the following expression for Tj is obtained: Die-junction temperature: Tj = 30°C + 5°C + (0.1°C/W + 1.5°C/W + Rθsa) × 15 W For this example, a Rθsa value of 3.1°C/W or less is required to maintain the die-junction temperature below the maximum value of Table 4. Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit used for comparing the thermal performance of various microelectronic packaging technologies, one should exercise caution when only using this metric in determining thermal management because no single parameter can adequately describe three-dimensional heat flow. The final die-junction operating temperature is not only a function of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to the component's power consumption, a number of factors affect the final operating die-junction |
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