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XC7445B Datasheet(PDF) 57 Page - Freescale Semiconductor, Inc

Part No. XC7445B
Description  RISC Microprocessor Hardware Specifications
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

XC7445B Datasheet(HTML) 57 Page - Freescale Semiconductor, Inc

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MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1
Freescale Semiconductor
57
System Design Information
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
The following section provides a heat sink selection example using one of the commercially available heat sinks.
9.8.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (RθJC + Rθint + Rθsa) × Pd
where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
RθJC is the junction-to-case thermal resistance
Rθint is the adhesive or interface material thermal resistance
Rθsa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation, the die-junction temperatures (Tj) should be maintained less than the value specified in Table 4.
The temperature of air cooling the component greatly depends on the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ta) may range from 30°
to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to 10°C. The thermal resistance of
the thermal interface material (Rθint) is typically about 1.5°C/W. For example, assuming a Ta of 30°C, a Tr of 5°C,
a CBGA package RθJC = 0.1, and a typical power consumption (Pd) of 15.0 W, the following expression for Tj is
obtained:
Die-junction temperature:
Tj = 30°C + 5°C + (0.1°C/W + 1.5°C/W + Rθsa) × 15 W
For this example, a Rθsa value of 3.1°C/W or less is required to maintain the die-junction temperature below the
maximum value of Table 4.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-merit
used for comparing the thermal performance of various microelectronic packaging technologies, one should
exercise caution when only using this metric in determining thermal management because no single parameter can
adequately describe three-dimensional heat flow. The final die-junction operating temperature is not only a function
of the component-level thermal resistance, but the system-level design and its operating conditions. In addition to
the
component's
power
consumption,
a
number
of
factors affect
the
final
operating
die-junction


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