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ISO7721BDW Datasheet(PDF) 5 Page - Texas Instruments

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Part No. ISO7721BDW
Description  High-Speed, Robust EMC, Basic Insulation Dual-Channel Digital Isolator
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
Logo TI1 - Texas Instruments

ISO7721BDW Datasheet(HTML) 5 Page - Texas Instruments

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5
ISO7721B
www.ti.com
SLLSEY9A – APRIL 2018 – REVISED APRIL 2019
Product Folder Links: ISO7721B
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Copyright © 2018–2019, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
ISO7721B
UNIT
DW (SOIC)
16 PINS
RθJA
Junction-to-ambient thermal resistance
86.5
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
49.6
°C/W
RθJB
Junction-to-board thermal resistance
49.7
°C/W
ψJT
Junction-to-top characterization parameter
32.3
°C/W
ψJB
Junction-to-board characterization parameter
49.2
°C/W
RθJC(bottom)
Junction-to-case(bottom) thermal resistance
n/a
°C/W
6.5 Power Ratings
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PD
Maximum power dissipation
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,
input a 50 MHz 50% duty cycle square wave
100
mW
PD1
Maximum power dissipation by side-1
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,
input a 50 MHz 50% duty cycle square wave
50
mW
PD2
Maximum power dissipation by side-2
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF,
input a 50 MHz 50% duty cycle square wave
50
mW


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