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ISO7721BDW Datasheet(PDF) 5 Page - Texas Instruments |
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ISO7721BDW Datasheet(HTML) 5 Page - Texas Instruments |
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5 ISO7721B www.ti.com SLLSEY9A – APRIL 2018 – REVISED APRIL 2019 Product Folder Links: ISO7721B Submit Documentation Feedback Copyright © 2018–2019, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) ISO7721B UNIT DW (SOIC) 16 PINS RθJA Junction-to-ambient thermal resistance 86.5 °C/W RθJC(top) Junction-to-case(top) thermal resistance 49.6 °C/W RθJB Junction-to-board thermal resistance 49.7 °C/W ψJT Junction-to-top characterization parameter 32.3 °C/W ψJB Junction-to-board characterization parameter 49.2 °C/W RθJC(bottom) Junction-to-case(bottom) thermal resistance n/a °C/W 6.5 Power Ratings PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PD Maximum power dissipation VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, input a 50 MHz 50% duty cycle square wave 100 mW PD1 Maximum power dissipation by side-1 VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, input a 50 MHz 50% duty cycle square wave 50 mW PD2 Maximum power dissipation by side-2 VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, input a 50 MHz 50% duty cycle square wave 50 mW |
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