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TSD221 Datasheet(PDF) 4 Page - FENGJUI TECHNOLOGY CO., LTD.

Part No. TSD221
Description  SMD POWER INDUCTOR-RoHS
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Manufacturer  FENGJUI [FENGJUI TECHNOLOGY CO., LTD.]
Direct Link  https://www.fengjui.com.tw/
Logo FENGJUI - FENGJUI TECHNOLOGY CO., LTD.

TSD221 Datasheet(HTML) 4 Page - FENGJUI TECHNOLOGY CO., LTD.

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FENG-JUI TECHNOLOGY CO., LTD
SMD POWER INDUCTOR-RoHS
Your Perfect Inductor
Rev.1801
GENERAL CHARACTERISTICS
1.
Operating temperature range: -40 TO + 105℃(Includes tem perature when the coil is heated)
2.
External appearance: On visual inspection, the coil has no external defects.
3.
Terminal strength: After soldering. Between copper plate and terminals of coil. Push in two directions of
X.Ywithstanding at below conditions.
Terminal should not peel off. (refer to figure at right) 5. 0N 60 sec.
4.
Insulating resist
ance: Over 100MΩ at 100V D.C. between coil and core.
5.
Dielectric strength: No dielectric breakdown at 100V D.C. for 1 minute between coil and core.
6.
Temperature characteristics: Inductance coefficient (0~2,000)x10-6/℃(-25~+80℃).
7.
Humidity characteristics(Moisture Resistance): Inductance deviation within ±5%, after 96 hours in 90~95%
relative humidity at 40 ±2℃and 1 hour drying under norm al condition.
8.
Vibration resistance: Inductance deviation within ±5%, after vibration for 1 hour. In each of three orientations
at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes.
9.
Shock resistance: Inductance deviation within ±5%, after being dropped once with 981m/s2 (100G) shock
attitude upon a rubber block method shock testing machine, in three different orientations.
10. Resistance to Soldering Heat: 260℃, 10 seconds(See attached recom m end reflow)
11. Storage environment: Storage condition:
Temperature Range: 10℃ ~ 35℃ (G enerally: 21℃ ~ 31℃)
,
Humidity Range: 50% ~ 80% RH
(Generally: 65% ~ 75%) ; Transportation condition:
Temperature Range:
-35℃ ~ 85℃ , H um idity R ang e: 50% ~ 95% R H
12. Use components within 6 months. If 6 months or more have elapsed, check soldarability before use.
13. Reflow profile recommend:
26 0
23 0
1 0
60
300
250
200
150
100
50
0
T( )
T (s
300
24 0
18 0
1 20
60
0
L ea d -f r ee h e a t en d u r a n ce t es t
2 45 ℃ P e a k
230 ℃
40
1 7 0 ± 10℃ ,6 0-120 S
30 0
25 0
20 0
15 0
10 0
50
0
T( )
T (s )
300
24 0
18 0
12 0
60
0
L e a d -f r ee th e r ec o m m e n d ed r ef lo w c o n d it io n


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