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XC6215 Datasheet(PDF) 76 Page - List of Unclassifed Manufacturers |
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XC6215 Datasheet(HTML) 76 Page - List of Unclassifed Manufacturers |
76 / 212 page Copyright © MediaTek Inc. All rights reserved. 76 ▪ Placement – Memory device must place as close to BB Chip as possible – Avoiding extra long trace (Max trace1500mil) – Avoiding other high frequency devices place close to Memory – Route these traces smoothly, reduce the via counts and avoiding traces interlace if possible – You can swap byte in order to reduce traces interlace if there has restriction in placement (only for SD/DDR RAM) – “Swap byte” means to connect DQS0 from BB chip to memory DQS1 in order to reduce the interlacing of data traces, e.g. D[0:7] from BB chip to memory D[8:15]. – Note: Swap the corresponding DQS ,DQM and DQx at the same time. Byte0 Byte0 Byte1 Byte1 Byte1 Byte0 Byte0 Byte1 Swap High Speed Memory Layout Considerations High Speed Memory Layout Considerations |
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