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908E626 Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc

Part No. 908E626
Description  Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
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Maker  FREESCALE [Freescale Semiconductor, Inc]
Homepage  http://www.freescale.com
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908E626 Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc

 
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Analog Integrated Circuit Device Data
Freescale Semiconductor
5
908E626
MAXIMUM RATINGS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent damage
to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation (Steady-
State)
Analog Chip Supply Voltage under Transient Conditions (1)
Microcontroller Chip Supply Voltage
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
V
Input Terminal Voltage
Analog Chip
Microcontroller Chip
VIN(ANALOG)
VIN(MCU)
-0.3 to 5.5
VSS-0.3 to VDD+0.3
V
Maximum Microcontroller Current per Terminal
All Terminals Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Terminals PTA0:PTA6, PTC0:PTC1
IPIN(1)
IPIN(2)
±15
±25
mA
Maximum Microcontroller VSS Output Current
IMVSS
100
mA
Maximum Microcontroller VDD Input Current
IMVDD
100
mA
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (1)
VBUS(SS)
VBUS(DYNAMIC)
-18 to 28
40
V
ESD Voltage
Human Body Model (2)
Machine Model (3)
Charge Device Model (4)
VESD1
VESD2
VESD3
±3000
±150
±500
V
THERMAL RATINGS
Storage Temperature
TSTG
-40 to 150
°C
Operating Case Temperature (5)
TC
-40 to 115
°C
Operating Junction Temperature(6)
TJ
-40 to 135
°C
Peak Package Reflow Temperature During Solder Mounting (7)
TSOLDER
245
°C
Notes
1.
Transient capability for pulses with a time of t < 0.5 sec.
2.
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).
3.
ESD2 testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 Ω).
4.
ESD3 testing is performed in accordance with Charge Device Model, robotic (CZAP =4.0 pF).
5.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
6.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions
7.
Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.


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