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TE28F640B3TC100 Datasheet(PDF) 9 Page - Intel Corporation |
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TE28F640B3TC100 Datasheet(HTML) 9 Page - Intel Corporation |
9 / 58 page 28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3 3UHOLPLQDU\ 3 2.0 Product Description This section explains device pin description and package pinouts. 2.1 Package Pinouts The 3 Volt Advanced Boot Block flash memory is available in 40-lead TSOP (x8, Figure 1), 48-lead TSOP (x16, Figure 2) and 48-ball µBGA(x8 and x16, Figure 3 and Figure 4, respectively) and 48-ball VF BGA (x16, Figure 4) packages. In all figures, pin changes necessary for density upgrades have been circled. 0580_01 NOTES: 1. 40-Lead TSOP available for 8- and 16-Mbit densities only. 2. Lower densities will have NC on the upper address pins. For example, an 8-Mbit device will have NC on Pin 38. Figure 1. 40-Lead TSOP Package for x8 Configurations A 17 GND A 20 A 19 A 10 DQ 7 DQ 6 DQ 5 DQ 4 V CCQ V CC NC DQ 3 DQ 2 DQ 1 DQ 0 OE# GND CE# A 0 A 16 A 15 A 14 A 13 A 12 A 11 A 9 A 8 WE# RP# V PP WP# A 18 A 7 A 6 A 5 A 4 A 3 A 2 A 1 16 M 8 M Advanced Boot Block 40-Lead TSOP 10 mm x 20 mm TOP VIEW 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 4 M |
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