Small Outline, 5 Lead, High

Speed Optocouplers

Technical Data

HCPL-M452

HCPL-M453

Features

• Surface Mountable

• Very Small, Low Profile

JEDEC Registered

Package Outline

• Compatible with Infrared

Vapor Phase Reflow and

Wave Soldering Processes

• Very High Common Mode

Transient Immunity:

15000 V/

Guaranteed (HCPL-M453)

• High Speed: 1 Mb/s

• TTL Compatible

• Guaranteed AC and DC

Performance over

Temperature: 0

• Open Collector Output

• Recognized Under the

Component Program of

U.L. (File No. E55361) for

Dielectric Withstand Proof

Test Voltage of 3750 Vac, 1

Minute

• Lead Free Option

CAUTION: The small device geometries inherent to the design of this bipolar component increase the component's

susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken

in handling and assembly of this component to prevent damage and/or degradation which may be induced by

ESD.

The SO-5 JEDEC registered

(MO-155) package outline does

not require “through holes” in a

PCB. This package occupies

approximately one-fourth the

footprint area of the standard

dual-in-line package. The lead

profile is designed to be

compatible with standard

surface mount processes.

These diode-transistor

optocouplers use an insulating

layer between the light emitting

diode and an integrated photon

detector to provide electrical

insulation between input and

output. Separate connections for

the photodiode bias and output

transistor collector increase the

speed up to a hundred times

SO-5 Package

Standard DIP

SO-8 Package

HCPL-M452

HCPL-4502

HCPL-0452

HCPL-M453

HCPL-4503

HCPL-0453

(Note: These devices equivalent to 6N135/6N136 devices but without the base lead.)

Description

These small outline high CMR,

high speed, diode-transistor opto-

couplers are single channel

devices in a five lead miniature

footprint. They are electrically

equivalent to the following Agilent

optocouplers: