F2270 Datasheet

© 2019 Integrated Device Technology, Inc.

3

January 16, 2019

Pin De sc ript ions

T a ble 1 .

Pin De sc ript ions

Number

Name

Description

1, 5 – 8, 12,

13

GND

Internally grounded. This pin must be grounded as close to the device as possible.

2, 4, 9, 11

NC

No internal connection. These pins can be left unconnected, have a voltage applied, or be connected to

ground (recommended).

3

RF1

RF Port 1. Matched to 75Ω. Since the RF pin internally has DC present, an external AC coupling capacitor

must be used. For low-frequency operation, increase the capacitor value to result in a low reactance at the

frequency of interest. An external series inductor of 2.4nH can also be used to improve the high frequency

match. This inductor, if used, should be placed as close to the device as possible.

10

RF2

RF Port 2. Matched to

75Ω. Since the RF pin internally has DC present, an external AC coupling capacitor

must be used. For low-frequency operation, increase the capacitor value to result in a low reactance at the

frequency of interest. An external series inductor of 2.8nH can also be used to improve the high frequency

match. This inductor, if used, should be placed as close to the device as possible.

14

Attenuator control voltage. Apply a voltage in the range specified in under “Recommended Operating

internal 100kΩ series resistor that drives a biased voltage divider network.

15

Power supply input. Bypass to ground (GND) with capacitors as close as possible to the pin.

16

Attenuator slope control. Set to logic LOW to enable negative attenuation slope (maximum attenuation at

internally connected to a 170kΩ pull-down resistor to ground.

– EPAD

Exposed paddle. Internally connected to ground. Solder this exposed paddle to a printed circuit board (PCB)

pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes.

These multiple ground vias are also required to achieve the specified RF performance.