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MSM5412222 Datasheet(PDF) 14 Page - OKI electronic componets

Part No. MSM5412222
Description  262,214-Word x 12-Bit Field Memory
Download  15 Pages
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Maker  OKI [OKI electronic componets]
Homepage  http://www.oki.com
Logo OKI - OKI electronic componets

MSM5412222 Datasheet(HTML) 14 Page - OKI electronic componets

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¡ Semiconductor
MSM5412222
14/15
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.54 TYP.
TSOP
II44-P-400-0.80-K
Mirror finish


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