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K6R3024V1D-HC09 Datasheet(PDF) 6 Page - Samsung semiconductor

Part # K6R3024V1D-HC09
Description  128K x 24 Bit High-Speed CMOS Static RAM(3.3V Operating)
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K6R3024V1D-HC09 Datasheet(HTML) 6 Page - Samsung semiconductor

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K6R3024V1D
CMOS SRAM
Revision 1.0
- 6 -
December 2001
for AT&T
NOTES(READ CYCLE)
1. WE is high for read cycle.
2. All read cycle timing is referenced from the last valid address to the first transition address.
3. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit condition and are not referenced to VOH or
VOL levels.
4. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to
device.
5. Transition is measured
±200mV from steady state voltage with Load(B). This parameter is sampled and not 100% tested.
6. Device is continuously selected with CS=VIL.
7. Address valid prior to coincident with CS transition low.
8. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycle.
9. CS represents CS1 , CS2 and CS3 in this data sheet. CS2 as of opposite polarity to CS1 and CS3.
TIMING WAVEFORM OF READ CYCLE(2) (WE=VIH)
CS
Address
OE
Data out
tAA
tOLZ
tLZ(4,5)
tOHZ
tRC
tOE
tCO
tPU
tPD
Valid Data
tHZ(3,4,5)
50%
50%
VCC
Current
ICC
ISB
Address
Data Out
Previous Valid Data
Valid Data
TIMMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS=OE=VIL, WE=VIH)
tAA
tRC
tOH


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