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AD840 Datasheet(PDF) 3 Page - Analog Devices

Part # AD840
Description  Wideband, Fast Settling Op Amp
Download  8 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD840 Datasheet(HTML) 3 Page - Analog Devices

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NOTES
1Input offset voltage specifications are guaranteed after 5 minutes at T
A = +25°C.
2Full power bandwidth = slew rate/2
π V
PEAK.
3Refer to Figures 22 and 23.
4“S” grade T
MIN–TMAX specifications are tested with automatic test equipment at T A = –55°C and TA = +125°C.
All min and max specifications are guaranteed. Specifications shown in boldface are tested on all production units.
Specifications subject to change without notice.
AD840
REV. C
–3–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Internal Power Dissipation
2
Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W
Cerdip (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
LCC (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
±6 V
Storage Temperature Range
Q, E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65
°C to +150°C
N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65
°C to +125°C
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . +175
°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300
°C
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions above those indicated in
the operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2Maximum internal power dissipation is specified so that T
J does not exceed
+175
°C at an ambient temperature of +25°C.
Thermal Characteristics:
θ
JC
θ
JA
Derate at
Cerdip Package
30
°C/W
110
°C/W
8.7 mW/
°C
Plastic Package
30
°C/W
100
°C/T
10 mW/
°C
LCC Package
35
°C/W
150
°C/W
6.7 mW/
°C
Recommended Heat Sink:
Aavid Engineering© #602B
ORDERING GUIDE
Models
Package Options
2
AD840JN
N-14
AD840KN
N-14
AD840JQ
Q-14
AD840KQ
Q-14
AD840SQ
Q-14
AD840SQ-883B
Q-14
5962-89640012A
Q-14
AD840SE-883B
E-20A
5962-8964001CA
E-20A
NOTES
1J and S Grade Chips also available.
2N = Plastic DIP; Q = Cerdip; E = LCC (Leadless
2Ceramic Chip Carrier).
Plastic DIP (N) Package
and
Cerdip (Q) Package
LCC (E) Package
AD840 Connection Diagrams
METALIZATION PHOTOGRAPH
Contact factory for latest dimensions.
Dimensions shown in inches and (mm).


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