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AD840 Datasheet(PDF) 3 Page - Analog Devices |
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AD840 Datasheet(HTML) 3 Page - Analog Devices |
3 / 8 page NOTES 1Input offset voltage specifications are guaranteed after 5 minutes at T A = +25°C. 2Full power bandwidth = slew rate/2 π V PEAK. 3Refer to Figures 22 and 23. 4“S” grade T MIN–TMAX specifications are tested with automatic test equipment at T A = –55°C and TA = +125°C. All min and max specifications are guaranteed. Specifications shown in boldface are tested on all production units. Specifications subject to change without notice. AD840 REV. C –3– ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Internal Power Dissipation 2 Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W Cerdip (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W LCC (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V S Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±6 V Storage Temperature Range Q, E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65 °C to +150°C N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65 °C to +125°C Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . +175 °C Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300 °C NOTES 1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Maximum internal power dissipation is specified so that T J does not exceed +175 °C at an ambient temperature of +25°C. Thermal Characteristics: θ JC θ JA Derate at Cerdip Package 30 °C/W 110 °C/W 8.7 mW/ °C Plastic Package 30 °C/W 100 °C/T 10 mW/ °C LCC Package 35 °C/W 150 °C/W 6.7 mW/ °C Recommended Heat Sink: Aavid Engineering© #602B ORDERING GUIDE Models Package Options 2 AD840JN N-14 AD840KN N-14 AD840JQ Q-14 AD840KQ Q-14 AD840SQ Q-14 AD840SQ-883B Q-14 5962-89640012A Q-14 AD840SE-883B E-20A 5962-8964001CA E-20A NOTES 1J and S Grade Chips also available. 2N = Plastic DIP; Q = Cerdip; E = LCC (Leadless 2Ceramic Chip Carrier). Plastic DIP (N) Package and Cerdip (Q) Package LCC (E) Package AD840 Connection Diagrams METALIZATION PHOTOGRAPH Contact factory for latest dimensions. Dimensions shown in inches and (mm). |
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