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BCR08PN Datasheet(PDF) 2 Page - Diotec Semiconductor |
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BCR08PN Datasheet(HTML) 2 Page - Diotec Semiconductor |
2 / 2 page BCR08PN Characteristics Kennwerte Tj = 25°C Min. Typ. Max. DC current gain – Kollektor-Basis-Stromverhältnis VCE = 5 V IC = 5 mA T1 - NPN T2 - PNP hFE 70 – – Collector-Emitter saturation voltage – Kollektor-Sättigungsspannung 1) IC = 10 mA IB = 0.5 mA T1 - NPN T2 - PNP VCEsat – – 300 mV Input voltage (on) – Eingangsspannung (Ein) VCE = 0.3 V IC = 2 mA T1 - NPN T2 - PNP VI(on) 500 mV – 1100 mV Input voltage (off) – Eingangs-Spannung (Aus) VCE = 5 V IC = 100 µA T1 - NPN T2 - PNP VI(off) 400 mV – 800 mV Collector-Base cutoff current – Kollektor-Basis-Reststrom VCB = 40 V E open T1 - NPN T2 - PNP ICBO – – 100 nA Emitter-Base cutoff current – Emitter-Basis-Reststrom VEB = 5 V C open T1 - NPN T2 - PNP IEBO – – 164 µA Gain-Bandwidth Product – Transitfrequenz VCE = 5 V IC = 10 mA, f = 100 MHz T1 - NPN T2 - PNP fT – 170 Mhz – Collector-Base Capacitance – Kollektor-Basis-Kapazität VCB = 10 V IE =ie = 0, f = 1 MHz T1 - NPN T2 - PNP CCBO – 2 pF – Input resistor – Eingangswiderstand R1 1.5 kΩ 2.2 kΩ 2.9 kΩ Resistance ratio – Widerstandsverhältnis R2/R1 0.042 0.047 0.052 Typical thermal resistance junction to ambient (per device) Typischer Wärmewiderstand Sperrschicht – Umgebung (pro Bauteil) RthA 420 K/W 2) Disclaimer: See data book page 2 or website Haftungssauschluss: Siehe Datenbuch Seite 2 oder Internet 1 Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2% 2 Mounted on P.C. board with 3 mm 2 copper pad at each terminal Montage auf Leiterplatte mit 3 mm 2 Kupferbelag (Lötpad) an jedem Anschluss 2 http://www.diotec.com/ © Diotec Semiconductor AG [%] P tot 120 100 80 60 40 20 0 [°C] T A 150 100 50 0 Power dissipation versus ambient temperature ) 2 Verlustleistung in Abh. von d. Umgebungstemp. ) 2 |
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