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STPS1L30A Datasheet(PDF) 4 Page - STMicroelectronics |
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STPS1L30A Datasheet(HTML) 4 Page - STMicroelectronics |
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4 / 7 page  STPS1L30 4/7 Figure 11: Forward voltage drop versus forward current (typical values, high level) Figure 12: Forward voltage drop versus forward current (maximum values, low level) Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA) Figure 14: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMB) I (A) FM 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.10 1.00 10.00 T =25°C j T =100°C j V (V) FM T =150°C j 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.0 0.5 1.0 1.5 2.0 2.5 3.0 I (A) FM T =25°C j T =125°C j V (V) FM T =150°C (typical values) j T =100°C j 01 2 3 45 0 20 40 60 80 100 120 140 S(Cu)(cm²) R (°C/W) th(j-a) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20 40 60 80 100 120 S(Cu)(cm²) R (°C/W) th(j-a) |
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