PACKAGING INFORMATION

Rev. C

06/13/03

Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time

without notice.

ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

450-mil Plastic SOP

Package Code: Q (32-pin)

D

SEATING PLANE

B

e

C

1

N

E1

A1

A

E

L

α

S

MILLIMETERS

INCHES

Symbol

Min.

Max.

Min.

Max.

No. Leads

32

A

—

3.00

—

0.118

A1

0.10

—

0.004

—

B

0.36

0.51

0.014

0.020

C

0.15

0.30

0.006

0.012

D

20.14

20.75

0.793

0.817

E

13.87

14.38

0.546

0.566

E1

11.18

11.43

0.440

0.450

e

1.27 BSC

0.050 BSC

L

0.58

0.99

0.023

0.039

α

0°

10°

0°

10°

S

—

0.86

—

0.034

Notes:

1. Controlling dimension: inches, unless

otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold

flash protrusions and should be measured

from the bottom of the package.

4. Formed leads shall be planar with respect to

one another within 0.004 inches at the

seating plane.