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LDS8681 Datasheet(PDF) 4 Page - IXYS Corporation

Part No. LDS8681
Description  800 mA, Dual Output LED Flash/PWM Dimming Lamp Driver
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Manufacturer  IXYS [IXYS Corporation]
Direct Link  http://www.ixys.com
Logo IXYS - IXYS Corporation

LDS8681 Datasheet(HTML) 4 Page - IXYS Corporation

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LDS8681
© 2009 IXYS Corp.
4
Doc. No. 8681_DS, Rev. N1.0
Characteristics subject to change without notice
PIN DESCRIPTION
Pin #
Name
Function
1
VIN
Charge pump input, connect to battery or supply
2
C1+
Flying capacitor 1 Positive terminal
3
C1-
Flying capacitor 1 Negative terminal
4
EN
Device enable (active high)
5
LEDB
LEDB cathode terminal
6
LEDA
LEDA cathode terminal
7
GND
Ground Reference
8
VOUT
Charge pump output connected to the LED anodes
PAD
PAD
Connect to GND on the PCB
Top view: TDFN 8-lead 2 X 3 mm
PIN FUNCTION
VIN is the supply pin for the charge pump. A small
1
μF ceramic bypass capacitor is required between
the VIN pin and ground near the device. The
operating input voltage range is from 2.7 V to 5.5 V. If
VIN falls below the under-voltage threshold, all LED
channels disable and the device enters shutdown
mode.
EN is the enable control logic input for all LED
channels. Guaranteed levels of logic high and logic
low are set at 1.4 V and 0.4 V respectively. To place
the device into zero current mode, the EN pin must
be held low for more than 50 ms.
VOUT is the charge pump output that is connected to
the LED anodes. A small 2.2
μF ceramic bypass
capacitor is required between the VOUT pin and
ground near the device.
GND is the ground reference for the charge pump.
The pin must be connected to the ground plane on
the PCB.
C1+, C1- are connected to each side of the ceramic
flying capacitor C1 = 1 µF
LEDA, LEDB provides the internal regulated current
source for each of the LED cathodes. These pins
enter high-impedance zero current state whenever
the device is in shutdown mode. These pins may be
teed together to provide sum of the currents set at
every channel.
PAD is the exposed pad underneath the package.
For best thermal performance, the pad should be
soldered to the PCB and connected to the ground
plane


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