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74LCX245BQX Datasheet(PDF) 2 Page - ON Semiconductor |
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74LCX245BQX Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 16 page ©1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX245 Rev. 1.11.1 74LCX245 Low Voltage Bidirectional Transceiver with 5V Tolerant Inputs and Outputs Features ■ 5V tolerant inputs and outputs ■ 2.3V to 3.6V VCC specifications provided ■ 7.0ns tPD max. (VCC = 3.3V), 10µA ICC max. ■ Power down high impedance inputs and outputs ■ Supports live insertion/withdrawal (1) ■ ±24mA output drive (VCC = 3.0V) ■ ■ Latch-up performance exceeds 500mA ■ ESD performance: – Human body model > 2000V – Machine model > 200V ■ Leadless DQFN package Note: 1. To ensure the high-impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum value or the resistor is determined by the current-sourcing capability of the driver. General Description The LCX245 contains eight non-inverting bidirectional buffers with 3-STATE outputs and is intended for bus oriented applications. The device is designed for low voltage (2.5V and 3.3V) VCC applications with capability of interfacing to a 5V signal environment. The T/R input determines the direction of data flow through the device. The OE input disables both the A and B ports by placing them in a high impedance state. The LCX245 is fabricated with an advanced CMOS tech- nology to achieve high speed operation while maintain- ing CMOS low power dissipation. Ordering Information Note: 2. DQFN package available in Tape and Reel only. Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. Order Number Package Number Package Description 74LCX245WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LCX245SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LCX245BQX(2) MLP20B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm 74LCX245MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LCX245MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Implements proprietary noise/EMI reduction circuitry December 2013 |
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