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MAX8632 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part No. MAX8632
Description  Integrated DDR Power-Supply Solution for Desktops,Notebooks, and Graphic Cards
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Maker  MAXIM [Maxim Integrated Products]
Homepage  http://www.maxim-ic.com
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MAX8632 Datasheet(HTML) 2 Page - Maxim Integrated Products

 
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PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAIN PWM CONTROLLER
VIN
228
Input Voltage Range
VDD, AVDD
4.5
5.5
V
Output Adjust Range
VOUT
0.7
5.5
V
FB = OUT
0.693
0.7
0.707
FB = GND
2.47
2.5
2.53
Output Voltage Accuracy
(Note 2)
FB = VDD
1.78
1.8
1.82
V
Soft-Start Ramp Time
tSS
Rising edge of SHDN to full current limit
1.7
ms
TON = GND (600kHz)
170
194
219
TON = REF (450kHz)
213
243
273
TON = open (300kHz)
316
352
389
On-Time
tON
VIN = 15V,
VOUT = 1.5V
(Note 3)
TON = AVDD (200kHz)
461
516
571
ns
Minimum Off-Time
tOFF_MIN
(Note 3)
200
300
450
ns
VIN Quiescent Supply Current
IIN
25
40
µA
VIN Shutdown Supply Current
SHDN = GND
1
5
µA
All on (PWM, VTT, and VTTR on)
2.5
5
AVDD Quiescent Supply Current
IAVDD
STBY = GND (only VTTR and PWM on)
1
2
mA
AVDD + VDD Shutdown Supply
Current
SHDN = GND
20
µA
Rising edge of VIN
4.05
4.25
4.40
V
AVDD Undervoltage-Lockout
Threshold
Hysteresis
50
mV
VDD Quiescent Supply Current
IVDD
Set VFB = 0.8V
1
5
µA
Integrated DDR Power-Supply Solution for
Desktops, Notebooks, and Graphic Cards
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = +15V, VDD = AVDD = V SHDN = STBY = VBST = VILIM = 5V, VOUT = VREFIN = VVTTI = 2.5V, UVP/OVP = TP0 = FB = SKIP
= GND, PGND1 = PGND2 = LX = GND, TON = OPEN, VVTTS = VVTT, TA = -40°C to +85°C, unless otherwise noted. Typical values
are at TA = +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VIN to GND .............................................................-0.3V to +30V
VDD, AVDD , VTTI to GND .........................................-0.3V to +6V
SHDN, REFIN to GND ..............................................-0.3V to +6V
SS, POK1, POK2, SKIP, ILIM, FB to GND ................-0.3V to +6V
STBY, TON, REF, UVP/OVP to GND ........-0.3V to (AVDD + 0.3V)
OUT, VTTR to GND ..................................-0.3V to (AVDD + 0.3V)
DL to PGND1..............................................-0.3V to (VDD + 0.3V)
DH to LX ....................................................-0.3V to (VBST + 0.3V)
LX to BST..................................................................-6V to +0.3V
LX to GND .................................................................-2V to +30V
VTT to GND...............................................-0.3V to (VVTTI + 0.3V)
VTTS to GND............................................-0.3V to (AVDD + 0.3V)
PGND1, PGND2, TP0 to GND ...............................-0.3V to +0.3V
REF Short Circuit to GND ...........................................Continuous
Continuous Power Dissipation (TA = +70°C)
28-Pin 5mm x 5mm Thin QFN (derate 35.7mW/°C
above +70°C).................................................................2.86W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C


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