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ADN2850BRUZ25 Datasheet(PDF) 10 Page - Analog Devices

Part No. ADN2850BRUZ25
Description  Nonvolatile Memory, Dual 1024-Position Digital Resistor
Download  30 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADN2850BRUZ25 Datasheet(HTML) 10 Page - Analog Devices

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ADN2850
Data Sheet
Rev. F | Page 10 of 30
12
11
10
1
3
4
9
2
SDO
GND
VSS
V1
PR
WP
VDD
V2
ADN2850
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD IS LEFT
FLOATING OR IS TIED TO VSS.
Figure 5. 16-Lead LFCSP Pin Configuration
Table 5. 16-Lead LFCSP Pin Function Descriptions
Pin No.
Mnemonic
Description
1
SDO
Serial Data Output. Serves readback and daisy-chain functions. Command 9 and Command 10 activate the SDO
output for the readback function, delayed by 24 or 25 clock pulses, depending on the clock polarity before and
after the data-word (see Figure 2 and Figure 3). In other commands, the SDO shifts out the previously loaded SDI
bit pattern, delayed by 24 or 25 clock pulses depending on the clock polarity (see Figure 2 and Figure 3). This
previously shifted out SDI can be used for daisy-chaining multiple devices. Whenever SDO is used, a pull-up
resistor in the range of 1 kΩ to 10 kΩ is needed.
2
GND
Ground Pin, Logic Ground Reference.
3
VSS
Negative Supply. Connect to 0 V for single-supply applications. If VSS is used in dual supply, it must be able to sink
2 mA for 15 ms when storing data to EEMEM.
4
V1
Log Output Voltage 1. Generates voltage from an internal diode configured transistor.
5
W1
Wiper terminal of RDAC1. ADDR (RDAC1) = 0x0.
6
B1
Terminal B of RDAC1.
7
B2
Terminal B of RDAC2.
8
W2
Wiper terminal of RDAC2. ADDR (RDAC2) = 0x1.
9
V2
Log Output Voltage 2. Generates voltage from an internal diode configured transistor.
10
VDD
Positive Power Supply.
11
WP
Optional Write Protect. When active low, WP prevents any changes to the present contents, except PR strobe.
CMD_1 and COMD_8 refresh the RDAC register from EEMEM. Tie WP to VDD, if not used.
12
PR
Optional Hardware Override Preset. Refreshes the scratchpad register with current contents of the EEMEM
register. Factory default loads midscale until EEMEM is loaded with a new value by the user. PR is activated
at the logic high transition. Tie PR to VDD, if not used.
13
CS
Serial Register Chip Select Active Low. Serial register operation takes place when CS returns to logic high.
14
RDY
Ready. Active high open-drain output. Identifies completion of Instruction 2, Instruction 3, Instruction 8,
Instruction 9, Instruction 10, and PR.
15
CLK
Serial Input Register Clock. Shifts in one bit at a time on positive clock edges.
16
SDI
Serial Data Input. Shifts in one bit at a time on positive clock CLK edges. MSB loads first.
EP
Exposed Pad. The exposed pad is left floating or is tied to VSS.


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