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ADN2850BRUZ25 Datasheet(PDF) 27 Page - Analog Devices

Part No. ADN2850BRUZ25
Description  Nonvolatile Memory, Dual 1024-Position Digital Resistor
Download  30 Pages
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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ADN2850BRUZ25 Datasheet(HTML) 27 Page - Analog Devices

 
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Data Sheet
ADN2850
Rev. F | Page 27 of 30
OUTLINE DIMENSIONS
COMPLIANT
TO JEDEC STANDARDS MO-220-WHHB.
1
0.80
BSC
BOTTOM VIEW
TOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDICATOR
5.10
5.00 SQ
4.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.35
0.30
0.25
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.75
0.60
0.50
3.25
3.10 SQ
2.95
Figure 44. 16-Lead Lead Frame Chip Scale Package [LFCSP]
5 mm × 5 mm Body and 0.75 mm Package Height
(CP-16-31)
Dimensions shown in millimeters
16
9
8
1
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 45. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2
RWB (kΩ)
Temperature Range
Package Description
Package Option
ADN2850BRUZ25
25
−40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADN2850BRUZ25-RL7
25
−40°C to +85°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADN2850BCPZ25
25
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16-31
ADN2850BCPZ25-RL7
25
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16-31
ADN2850BCPZ250
250
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16-31
EVAL-ADN2850SDZ
Evaluation Board
1 Z = RoHS Compliant Part.
2 The evaluation board is shipped with the 25 kΩ RWB resistor option; however, the board is compatible with all available resistor value options.


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