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VSC7938 Datasheet(PDF) 4 Page - Vitesse Semiconductor Corporation |
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VSC7938 Datasheet(HTML) 4 Page - Vitesse Semiconductor Corporation |
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VITESSE SEMICONDUCTOR CORPORATION Preliminary Data Sheet VSC7938 SONET/SDH 3.125Gb/s Laser Diode Driver with Automatic Power Control Page 4 G52349-0, Rev 3.0 01/20/01 © VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012 Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com Internet: www.vitesse.com Bare Die Descriptions Figure 1: Pad Assignments VSC7938 Die Size: 1773µm x 2233µm (0.0698" x 0.0879") Die Thickness: 625µm (0.0246") Pad Pitch: 115µm (0.0045") Pad Size: 95µm x 95µm (0.0037 " x 0.0037") Pad to Pad Clearance: 20µm (0.0008 ") Pad Passivation Opening: 95µm x 95µm (0.0037" x 0.0037") Scribe Size: 75µm (0.0030 ") Pad 10 CLK- Pad 9 CLK+ Pad 8 VCC1 Pad 7 GND1 Pad 6 VCC1 Pad 5 DATA- Pad 4 DATA+ Pad 3 VCC1 Pad 2 GND1 Pad 1 GND2 Pad 48 VCC2 Pad 47 BIASMAX 20µm (0.0008") 2233µm (0.0879") 1773µm (0.0698") 75µm (0.0030") Pad 46 MODSET Pad 45 GND2 Pad 44 APCSET Pad 43 AUTSEL Pad 42 GND2 Pad 41 PB_GND Pad 40 GND3 Pad 39 PB_GND Pad 38 CAPC Pad 37 VCC3 Pad 36 GND3 Pad 12 GND1 Pad 13 LATCH Pad 14 ENABLE Pad 15 DISABLE Pad 16 GND1 Pad 17 SLWSTRT Pad 18 VCC1 Pad 19 FAIL Pad 20 GND4 Pad 21 PB_GND Pad 22 APCFILT Pad 23 GND4 Pad 24 VCC4 Pad 25 BIAS Pad 11 VCC1 Pad 27 VCC4 Pad 28 DB_OUT+ Pad 29 OUT+ Pad 30 OUT- Pad 31 DB_OUT- Pad 32 VCC4 Pad 33 GND4 Pad 34 GND3 Pad 35 MD Pad 26 PB_GND |
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