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S29AL032D90TFI043 Datasheet(PDF) 67 Page - SPANSION |
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S29AL032D90TFI043 Datasheet(HTML) 67 Page - SPANSION |
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67 / 69 page  June 13, 2005 S29AL032D_00_A3 S29AL032D 65 Ad vance Info rmat i o n Physical Dimensions VBN048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 10.0 x 6.0 mm 3425\ 16-038.25 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT AS NOTED). 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER BALLS. 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. NOT USED. 9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. PACKAGE VBN 048 JEDEC N/A 10.00 mm x 6.00 mm NOM PACKAGE SYMBOL MIN NOM MAX NOTE A --- --- 1.00 OVERALL THICKNESS A1 0.17 --- --- BALL HEIGHT A2 0.62 --- 0.73 BODY THICKNESS D 10.00 BSC. BODY SIZE E 6.00 BSC. BODY SIZE D1 5.60 BSC. BALL FOOTPRINT E1 4.00 BSC. BALL FOOTPRINT MD 8 ROW MATRIX SIZE D DIRECTION ME 6 ROW MATRIX SIZE E DIRECTION N 48 TOTAL BALL COUNT φb 0.35 --- 0.45 BALL DIAMETER e 0.80 BSC. BALL PITCH SD / SE 0.40 BSC. SOLDER BALL PLACEMENT NONE DEPOPULATED SOLDER BALLS +0.20 -0.50 1.00 Ø0.50 SEATING PLANE A1 ID. A1 CORNER A2 A Øb e D E B A M Ø0.15 C M 7 7 6 e SE SD C 0.10 A1 C 6 5 4 3 2 A B C D E F G 1 H B A C 0.08 E1 D1 C Ø0.08 |
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