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S71PL129JB0BFW9P2 Datasheet(PDF) 9 Page - SPANSION |
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S71PL129JB0BFW9P2 Datasheet(HTML) 9 Page - SPANSION |
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9 / 149 page  December 23, 2004 S71PL129Jxx_00_A5 9 Advance Informatio n Ordering Information The order number is formed by a valid combinations of the following: S71PL 129 J B0 BA W 9 Z 0 PACKING TYPE 0= Tray 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER See valid combinations table. PACKAGE MODIFIER 9 = 8 x 11.6 mm, 1.2 mm height, 64 balls (TLA064) TEMPERATURE RANGE W= Wireless (-25 °C to +85°C) I = Industrial (-40 °C to +85°C) PACKAGE TYPE BA = Fine-pitch BGA Lead (Pb)-free compliant package BF = Fine-pitch BGA Lead (Pb)-free package pSRAM DENSITY C0 = 64 Mb pSRAM B0 = 32 Mb pSRAM A0 = 16 Mb pSRAM PROCESS TECHNOLOGY J = 110 nm, Floating Gate Technology FLASH DENSITY 129 = 128Mb, dual CE# PRODUCT FAMILY S71PL Multi-chip Product (MCP) 3.0-volt Simultaneous Read/Write, Page Mode Flash Memory and RAM |
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