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S71GL064A08BFW0F0 Datasheet(PDF) 10 Page - SPANSION |
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S71GL064A08BFW0F0 Datasheet(HTML) 10 Page - SPANSION |
10 / 102 page 10 S71GL032A_00A0 March 31, 2005 Advance Info rmation Ordering Information The order number is formed by a valid combinations of the following: S71GL 032 A 80 BA W 0 F 0 PACKING TYPE 0= Tray 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER See the Valid Combinations table. PACKAGE MODIFIER 0 = 7 x 9 mm, 1.2 mm height, 56 balls (TLC056) TEMPERATURE RANGE W= Wireless (-25 °C to +85°C) I = Industrial (-40 °C to +85°C) PACKAGE TYPE BA = Fine-pitch BGA Lead (Pb)-free compliant package BF = Fine-pitch BGA Lead (Pb)-free package pSRAM DENSITY 80 = 8 Mb pSRAM 40 = 4 Mb pSRAM 08 = 8 Mb SRAM 04 = 4 Mb SRAM PROCESS TECHNOLOGY A = 200 nm, MirrorBit Technology FLASH DENSITY 064 = 64Mb 032 = 32Mb PRODUCT FAMILY S71GL Multi-chip Product (MCP) 3.0-volt Page Mode Flash Memory and RAM |
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