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CY7C1386C-167AI Datasheet(PDF) 8 Page - Cypress Semiconductor

Part # CY7C1386C-167AI
Description  18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM
Download  34 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1386C-167AI Datasheet(HTML) 8 Page - Cypress Semiconductor

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CY7C1386C
CY7C1387C
Document #: 38-05239 Rev. *B
Page 8 of 34
TDI
-
U3
P5
JTAG serial
input
Synchronous
Serial data-In to the JTAG circuit. Sampled on the
rising edge of TCK. If the JTAG feature is not being
utilized, this pin can be disconnected or connected to
VDD. This pin is not available on TQFP packages.
TMS
-
U2
R5
JTAG serial
input
Synchronous
Serial data-In to the JTAG circuit. Sampled on the
rising edge of TCK. If the JTAG feature is not being
utilized, this pin can be disconnected or connected to
VDD. This pin is not available on TQFP packages.
TCK
-
U4
R7
JTAG-Clock
Clock input to the JTAG circuitry. If the JTAG feature
is not being utilized, this pin must be connected to VSS.
This pin is not available on TQFP packages.
NC
14,16,66,39,
38
B1,C1,R1,
T1,T2,J3,
D4,L4,5J,
5R,6T,6U,
B7,C7,R7
A11,B1,C2,
C10,H1,H3,
H9,H10,N2,
N5,N7,N10,
P1,A1,B11,
P2,R2
-
No Connects. Not internally connected to the die
CY7C1387C:Pin Definitions
Name
TQFP
BGA
(2-Chip
Enable)
fBGA
I/O
Description
A0, A1 , A
37,36,32,33,
34,35,42,43,
44,45,46,47,
48,49,50,80,
81,82,99,
100
P4,N4,A2,
B2,C2,R2,
T2,A3,B3,
C3,T3,A5,
B5,C5,T5,
A6,B6,C6,
R6,T6
R6,P6,A2,
A10,A11,B2,
B10,N6,P3,
P4,P8,P9,
P10,P11,R3,
R4,R8,R9,
R10,R11
Input-
Synchronous
Address Inputs used to select one of the 1M address
locations. Sampled at the rising edge of the CLK if
ADSP or ADSC is active LOW, and CE1, CE2, and
CE3[2] are sampled active. A1: A0 are fed to the two-bit
counter.
BWA,BWB
93,94
G3,L5
B5,A4
Input-
Synchronous
Byte Write Select Inputs, active LOW. Qualified with
BWE to conduct byte writes to the SRAM. Sampled on
the rising edge of CLK.
GW
88
H4
B7
Input-
Synchronous
Global Write Enable Input, active LOW. When
asserted LOW on the rising edge of CLK, a global write
is conducted (ALL bytes are written, regardless of the
values on BWX and BWE).
BWE
87
M4
A7
Input-
Synchronous
Byte Write Enable Input, active LOW. Sampled on the
rising edge of CLK. This signal must be asserted LOW
to conduct a byte write.
CLK
89
K4
B6
Input-
Clock
Clock Input. Used to capture all synchronous inputs to
the device. Also used to increment the burst counter
when ADV is asserted LOW, during a burst operation.
CE1
98
E4
A3
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the
rising edge of CLK. Used in conjunction with CE2 and
CE3[2] to select/deselect the device. ADSP is ignored if
CE1 is HIGH.
CE2[2]
97
-
B3
Input-
Synchronous
Chip Enable 2 Input, active HIGH. Sampled on the
rising edge of CLK. Used in conjunction with CE1 and
CE3[2] to select/deselect the device.
CY7C1386C–Pin Definitions (continued)
Name
TQFP
BGA
(1 Chip
Enable)
fBGA
I/O
Description


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