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AD5934 Datasheet(PDF) 30 Page - Analog Devices |
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AD5934 Datasheet(HTML) 30 Page - Analog Devices |
30 / 31 page ![]() AD5934 Data Sheet Rev. E | Page 30 of 31 LAYOUT AND CONFIGURATION POWER SUPPLY BYPASSING AND GROUNDING When accuracy is important in a circuit, carefully consider the power supply and ground return layout on the board. The printed circuit board (PCB) containing the AD5934 should have separate analog and digital sections, each having its own area of the board. If the AD5934 is in a system where other devices require an AGND-to-DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD5934. The power supply to the AD5934 should be bypassed with 10 µF and 0.1 µF capacitors. The capacitors should be physically as close as possible to the device, with the 0.1 µF capacitor ideally right up against the device. The 10 µF capacitors are the tantalum bead type. It is important that the 0.1 µF capacitor has low effective series resistance (ESR) and effective series inductance (ESI); common ceramic types of capacitors are suitable. The 0.1 µF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching. The power supply line itself should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feed- through effects on the board. The best board layout technique is the microstrip technique where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a 2-layer board. |
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