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74LCX162244MEA Datasheet(PDF) 2 Page - ON Semiconductor

Part No. 74LCX162244MEA
Description  Low Voltage 16-Bit Buffer/Line Driver
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

74LCX162244MEA Datasheet(HTML) 2 Page - ON Semiconductor

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© 2005 Fairchild Semiconductor Corporation
September 2000
Revised May 2005
Low Voltage 16-Bit Buffer/Line Driver
with 26: Series Resistors in Outputs
General Description
The LCX162244 contains sixteen non-inverting buffers with
3-STATE outputs designed to be employed as a memory
and address driver, clock driver, or bus oriented transmit-
ter/receiver. The device is nibble controlled. Each nibble
has separate 3-STATE control inputs which can be shorted
together for full 16-bit operation.
The LCX162244 is designed for low voltage (2.5V or 3.3V)
VCC applications with capability of interfacing to a 5V signal
In addition, the outputs include equivalent 26
: (nominal)
series resistors to reduce overshoot and undershoot and
are designed to sink/source up to 12 mA at VCC 3.0V.
The LCX162244 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
■ 5V tolerant inputs and outputs
■ 2.3V–3.6V VCC specifications provided
■ Outputs include equivalent series resistance of 26
: to
make external termination resistors unnecessary and
reduce overshoot and undershoot
■ 5.3 ns tPD max (VCC 3.0V), 20 PA ICC max
■ Power down high impedance inputs and outputs
r12 mA output drive (VCC 3.0V)
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human body model
! 2000V
Machine model
! 200V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Note 1: BGA package available in Tape and Reel only.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number
Package Number
Package Description
(Note 1)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
(Note 2)
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
(Note 2)
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

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