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IK2312 Datasheet(PDF) 7 Page - IK Semicon Co., Ltd |
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IK2312 Datasheet(HTML) 7 Page - IK Semicon Co., Ltd |
7 / 8 page IK2312 7 2015. June. Ver. 02 LAYOUT CONSIDERATIONS Single Point Grounding Use a single point ground connection from the input filter capacitor to the area of copper connected to the GND pin. Bypass Capacitor (CDD) The VDD pin bypass capacitor CDD should be located as near as possible to the VDD and GND pins. Switching Loop Areas The area of the switching loop connecting the input filter capacitor CIN, the diode D and the IK2312 together should be kept as small as possible. The switching loop area connecting the output filter capacitor CO, the inductor L and the diode D together should be kept as small as possible. Thermal Considerations vs. Radiated EMI The copper area where GND pin is connected acts not only as a single point ground, but also as a heat sink. This area should be maximized for good heat sinking. The same applies to the cathode of the freewheeling diode D. Both nodes are quiet and therefore, will not cause radiated RF emission. The switching node copper area connected to the DRAIN pin of the IK2312, the anode of D and the inductor L needs to be minimized. A large switching node area can increase high frequency radiated EMI. Input Filter Layout Considerations The input circuits of the EMI filter must not be placed in the direct proximity to the inductor L in order to avoid magnetic coupling of its leakage fields. This consideration is especially important when unshielded construction of L is used. When an axial input EMI filter inductor LIN is selected, it must be positioned orthogonal with respect to L. The loop area formed by CF, LF and CIN should be minimized. The input lead wires must be twisted together. |
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