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8533AG-01LF Datasheet(PDF) 11 Page - Integrated Device Technology

Part No. 8533AG-01LF
Description  Different ial-to-3.3V LVPECL Fanout Buffer
Download  17 Pages
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

8533AG-01LF Datasheet(HTML) 11 Page - Integrated Device Technology

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8533-01 Data Sheet
©2016 Integrated Device Technology, Inc
Revision F January 19, 2016
11
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the 8533-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 8533-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX = VCC_MAX * IEE_MAX = 3.465V * 50mA = 173.3mW
Power (outputs)
MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 30mW = 120mW
Total Power
_MAX (3.465V, with all outputs switching) = 173.3mW + 120mW = 293.3mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for the devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming
a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.293W * 66.6°C/W = 89.5°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θJA
by Velocity (Linear Feet per Minute)
TABLE 6. THERMAL RESISTANCE θJA FOR 20-PIN TSSOP, FORCED CONVECTION
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
98.0°C/W
88.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
73.2°C/W
66.6°C/W
63.5°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.


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