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## 8533AG-01LF Datasheet(PDF) 11 Page - Integrated Device Technology

 Part No. 8533AG-01LF Description Different ial-to-3.3V LVPECL Fanout Buffer Download 17 Pages Scroll/Zoom 100% Manufacturer IDT [Integrated Device Technology] Direct Link http://www.idt.com Logo

## 8533AG-01LF Datasheet(HTML) 11 Page - Integrated Device Technology

 11 / 17 page8533-01 Data Sheet©2016 Integrated Device Technology, IncRevision F January 19, 201611POWER CONSIDERATIONSThis section provides information on power dissipation and junction temperature for the 8533-01.Equations and example calculations are also provided.1. Power Dissipation.The total power dissipation for the 8533-01 is the sum of the core power plus the power dissipated in the load(s).The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.•Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 50mA = 173.3mW•Power (outputs)MAX = 30mW/Loaded Output pairIf all outputs are loaded, the total power is 4 * 30mW = 120mWTotal Power_MAX (3.465V, with all outputs switching) = 173.3mW + 120mW = 293.3mW2. Junction Temperature.Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability ofthe device. The maximum recommended junction temperature for the devices is 125°C.The equation for Tj is as follows: Tj = θJA * Pd_total + TATj = Junction TemperatureθJA= Junction-to-Ambient Thermal ResistancePd_total = Total Device Power Dissipation (example calculation is in section 1 above)TA = Ambient TemperatureIn order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuminga moderate air ﬂow of 200 linear feet per minute and a multi-layer board, the appropriate value is 66.6°C/W per Table 6 below.Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:70°C + 0.293W * 66.6°C/W = 89.5°C. This is well below the limit of 125°C.This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air ﬂow,and the type of board (single layer or multi-layer).θJAby Velocity (Linear Feet per Minute)TABLE 6. THERMAL RESISTANCE θJA FOR 20-PIN TSSOP, FORCED CONVECTION0200500Single-Layer PCB, JEDEC Standard Test Boards114.5°C/W98.0°C/W88.0°C/WMulti-Layer PCB, JEDEC Standard Test Boards73.2°C/W66.6°C/W63.5°C/WNOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.

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